Semiconductor Applications

Our electroformed Ni-Co alloy stencils, developed specifically for semiconductor processes, are manufactured using precision electroforming techniques and high-hardness Ni-Co materials. They offer exceptional dimensional stability, vertical sidewalls, and outstanding surface quality. These stencils are especially suitable for wafer-level packaging (WLP), flip-chip, BGA/CSP reballing, underfill pre-printing, and various fine-pitch, high-reliability applications.

• Ultra-Fine Feature Capability: Supports fine-pitch aperture and spacing designs.

• Electroformed Vertical Apertures: No taper, no thermal distortion, ensuring consistent solder paste/ball release.

• High-Strength, Deformation-Resistant Material: Ni-Co alloy with hardness > HV600, wear- and crack-resistant, for long service life.

• Excellent Thickness Uniformity: ±3~5μm precision enhances process stability and solder joint quality.

• Ultra-Low Surface Roughness: Ra ≤ 0.2μm, ideal for low-clearance and high-precision applications.

• Compatible with Step/3D Structures: Supports packaging needs for uneven components, micro bumps, and spatial compensation.

• Applications

• Solder paste/underfill printing for wafer-level packaging (WLP, WLCSP).

• Solder ball reballing stencils for BGA / CSP / Flip-Chip.

• Fan-out / System-in-Package fine-pitch structures.

• Circuit compensation and micron-level bump printing for advanced packaging.

• Metal masks for semiconductor test fixtures or special templates.

• Our Advantages

• Expertise in semiconductor stencil design and high-yield production control.

• In-house electroforming line supports both prototyping and mass production.

• Professional engineering team provides design optimization based on packaging files.

• Collaborative development of 3D, step, and hybrid structure stencils.

• Compatible with laser/optical automated inspection systems; supports cleanroom packaging and shipment.