PCB 產業

• Introduction

Our company specializes in the production of electroformed Ni-Co stencils, meticulously designed to meet the demands of SMT solder paste printing, BGA reballing, and high-density packaging in the PCB manufacturing process. Electroforming technology ensures ultra-high precision and excellent surface quality. Combined with high-hardness Ni-Co alloy, it significantly enhances yield, accuracy, and stability in PCB assembly, making it an indispensable high-end consumable in modern electronics manufacturing.

• Precision Aperture Control: Electroforming ensures vertical, burr-free apertures for stable solder paste release.

• Ultra-Flat Stencil Surface: Improves solder paste thickness uniformity and solder joint quality.

• High-Hardness Ni-Co Alloy: Wear-resistant and deformation-resistant, ideal for high-frequency printing and automated equipment.

• Support for Fine-Pitch Designs: Suitable for precise PCB components with fine pitch.

• Multiple Stencil Structures Available: Flat, step, and 3D types customizable according to PCB design.

• High Solder Paste Utilization: Reduces paste residue and risk of cold solder joints, effectively improving SMT yield.

• Applications

• SMT solder paste printing (suitable for QFN, BGA, CSP, and other high-density packages).

• PCB reballing stencils.

• Hybrid boards (high current + fine-pitch mixed designs).

• Electronics with high yield requirements (automotive, communication, medical).

• Precision manufacturing and automated SMT lines.

• Our Advantages

• In-house electroforming line ensures fast lead time and stable quality.

• Professional technical team provides support for design files and structural recommendations.

• Supports prototyping and mass production, adaptable to all PCB assembly scenarios.

• Comprehensive product line compatible with laser/optical inspection systems for seamless integration with production lines.