Ball mount Stencil

• Product Overview

We specialize in manufacturing high-precision electroformed Ni-Co alloy reballing stencils, designed for advanced packaging applications such as BGA, CSP, and WLCSP. Using cutting-edge electroforming processes and durable Ni-Co alloy material, these stencils offer excellent aperture precision, outstanding wear resistance, and superior dimensional stability, making them ideal for ultra-fine pitch and automated reballing operations. They help customers improve yield rates and production efficiency.

• Key Features

• Electroforming Process: Delivers vertical aperture walls, smooth edges, burr-free, and no thermal impact.

• High Aperture Accuracy: Tolerances up to ±3 μm ensure uniform reballing results.

• Ni-Co Alloy Material: High hardness, abrasion resistance, and corrosion resistance for extended lifespan.

• Supports Fine-Pitch Packaging: Suitable for solder balls > 70 μm.

• Product Applications

• BGA / CSP / WLCSP reballing.

• Advanced packaging: SiP, PoP, Fan-Out.

• Wafer-level packaging (WLP) and high-precision rework.

• Compatible with lab setups, production lines, and automated reballing machines.

• Our Advantages

• Custom Design Support: Dedicated stencil layout design and fast delivery services.

• In-House Electroforming Line with expert engineering team.

• Design Compatible with Gerber / CAD / IPC Standards.

• Rapid prototyping and scalable volume production.