Electroformed ball-mount stencil

• Product Overview

EverGlow provides high-precision electroformed nickel-cobalt ball placement stencils designed for BGA, CSP, WLCSP, ABF substrates, and advanced semiconductor packaging applications.

Manufactured using advanced Electroforming technology and high-hardness Ni-Co alloy, our products integrate proprietary Heterogeneous Interface Engineering and 2.5D Flow-Control Microstructure technologies to deliver exceptional dimensional accuracy, wear resistance, and long-term process stability.

The stencils are optimized for ultra-fine pitch packaging and automated ball placement processes, supporting high-reliability electronic manufacturing.

• Key Features

• Advanced Electroforming Technology
  Produces vertical aperture walls with smooth edges while minimizing burrs and thermal distortion.

• Excellent Dimensional Accuracy
  Aperture tolerance controlled within ±3 μm, providing outstanding ball placement consistency and repeatability.

• High-Hardness Ni-Co Alloy
  Offers superior wear resistance, corrosion resistance, and dimensional stability for extended service life.

• Designed for Fine-Pitch Packaging
  Suitable for ball diameters of 50 μm and above in high-density semiconductor packaging.

• Proprietary Technology Platform
  Combines Electroforming, Heterogeneous Interface Engineering, and 2.5D Flow-Control Microstructure technologies to support precision ball placement and customized packaging solutions.

• Product Applications

• BGA / CSP / WLCSP / ABF Ball Placement

• SiP, PoP and Fan-Out Packaging

• Wafer-Level Packaging (WLP) and Precision Reballing

• Automated Ball Placement Systems

• AI/HPC, Automotive Electronics, High-Reliability Semiconductor Packaging

• Our Advantages

• Custom Design Support: Dedicated stencil layout design and fast delivery services.

• In-House Electroforming Line with expert engineering team.

• Design Compatible with Gerber / CAD / IPC Standards.

• Rapid prototyping and scalable volume production.