As of June 2025, ENVAR Precision Co., Ltd. has officially changed its name to EVERGLOW Precision Co., Ltd.
The Ni-Co Alloy Step Stencil, manufactured using electroforming technology, features a multi-thickness stepped structure with precisely controlled regional thickness. This design supports varying solder paste heights on a single stencil, making it ideal for advanced SMT processes involving mixed-component PCBs, fine-pitch and high-current components, and complex board layouts.
Electroformed Step Structure: Precisely controlled thickness variations without thermal effects; vertical and smooth aperture walls.
Ni-Co Alloy Material: High hardness, anti-deformation, excellent wear resistance for long-term, high-intensity usage.
High-Precision Layer Control: Supports multiple step levels (e.g., 80 μm ↔ 120 μm) to ensure accurate solder paste release across different regions.
Burr-Free Apertures: Suitable for ultra-fine pitch components.
SMT mixed-component boards (fine pitch + large components).
Hybrid printing for QFN, BGA, and LGA packages.
Co-layout of power modules, high-current, and miniature components.
High-reliability, high-yield manufacturing processes.
Proprietary in-house electroformed step-stencil technology.
Supports fast customization and original layout conversion (Gerber / CAD).
Reliable quality control with strict tolerance verification.
Compatible with automated printing equipment to enhance production efficiency and consistency.