Step Solder Paste Stencil

• Product Overview

The Ni-Co Alloy Step Stencil, manufactured using electroforming technology, features a multi-thickness stepped structure with precisely controlled regional thickness. This design supports varying solder paste heights on a single stencil, making it ideal for advanced SMT processes involving mixed-component PCBs, fine-pitch and high-current components, and complex board layouts.

• Key Features

• Electroformed Step Structure: Precisely controlled thickness variations without thermal effects; vertical and smooth aperture walls.

• Ni-Co Alloy Material: High hardness, anti-deformation, excellent wear resistance for long-term, high-intensity usage.

• High-Precision Layer Control: Supports multiple step levels (e.g., 80 μm ↔ 120 μm) to ensure accurate solder paste release across different regions.

• Burr-Free Apertures: Suitable for ultra-fine pitch components.

• Product Applications

• SMT mixed-component boards (fine pitch + large components).

• Hybrid printing for QFN, BGA, and LGA packages.

• Co-layout of power modules, high-current, and miniature components.

• High-reliability, high-yield manufacturing processes.

• Our Advantages

• Proprietary in-house electroformed step-stencil technology.

• Supports fast customization and original layout conversion (Gerber / CAD).

• Reliable quality control with strict tolerance verification.

• Compatible with automated printing equipment to enhance production efficiency and consistency.