As of June 2025, ENVAR Precision Co., Ltd. has officially changed its name to EVERGLOW Precision Co., Ltd.
We offer high-precision electroformed Ni-Co alloy flat stencils, specifically designed for SMT printing, BGA reballing, and advanced packaging processes. Manufactured using advanced electroforming techniques and high-hardness Ni-Co alloy, these stencils feature exceptional flatness, vertical apertures, and excellent wear resistance, making them ideal for fine-pitch, micro-volume solder paste printing, and high-repeatability automated production lines.
Highly Stable Flat Structure: Seamless, step-free design with uniform thickness ensures consistent print quality.
High Aperture Accuracy & Repeatability: Tolerance up to ±3 μm guarantees stable performance in every cycle.
Heat-Free Electroforming Process: Avoids taper holes and thermal distortion common in laser-cut stencils.
Durable Ni-Co Alloy Material: High hardness and corrosion resistance for extended use.
Ultra-Smooth Aperture Walls & Surface Finish: Improves paste release, reduces residue, and boosts transfer efficiency
SMT solder paste printing (Fine-pitch QFP, CSP, BGA, etc.)
BGA / WLCSP reballing stencils.
Miniature or high-density mixed component boards.
Integration with automated solder paste printers.
High-reliability electronic modules, automotive, and medical electronics.
Precision solder paste printing for Mini LED applications.
In-house electroforming production line ensures fast prototyping and stable mass delivery.
Supports custom aperture design, thickness, and layout (Gerber / CAD).
Reliable mass production quality with strict tolerance control.
Compatible with step-type and 3D structure extensions for versatile applications.