Solder Paste / Flux Stencil

• Product Overview

EverGlow provides high-precision flat electroformed nickel-cobalt stencils designed for SMT solder paste printing, BGA ball placement, and advanced semiconductor packaging applications.

Manufactured using advanced Electroforming technology and high-hardness Ni-Co alloy, our stencils feature excellent dimensional accuracy, ultra-flat surfaces, vertical aperture walls, and outstanding wear resistance.

Combined with EverGlow's proprietary Heterogeneous Interface Engineering and 2.5D Flow-Control Microstructure technologies, the stencils are optimized for fine-pitch printing, high-density packaging, and highly repeatable automated manufacturing processes.

• Key Features

• High-Precision Electroforming
  Produces vertical aperture walls with smooth edges for superior dimensional consistency.

• Excellent Dimensional Accuracy
  Aperture tolerance controlled within ±3 μm with outstanding repeatability.

• Ultra-Smooth Aperture Surface
  Helps improve solder paste transfer efficiency while reducing residue.

• High-Hardness Ni-Co Alloy
  Provides excellent wear resistance, corrosion resistance, and long service life.

• Designed for High-Density Packaging
  Suitable for fine-pitch, high-density, and advanced electronic packaging applications.

• Proprietary Technology Platform
  Combines Heterogeneous Interface Engineering with 2.5D Flow-Control Microstructure technology to support customized flat, stepped, and three-dimensional electroformed structures.

• Product Applications

• SMT Solder Paste Printing (Fine-Pitch QFP, CSP, BGA)

• BGA / WLCSP Reballing

• HDI & ABF Package Substrates

• Mini / Micro LED Precision Printing

• Automotive, Medical, and High-Reliability Electronics

• Automated SMT Printing Systems

• Our Advantages

• In-house electroforming production line ensures fast prototyping and stable mass delivery.

• Supports custom aperture design, thickness, and layout (Gerber / CAD).

• Reliable mass production quality with strict tolerance control.

• Compatible with step-type and 3D structure extensions for versatile applications.