Solder Paste / Flux Stencil

• Product Overview

We offer high-precision electroformed Ni-Co alloy flat stencils, specifically designed for SMT printing, BGA reballing, and advanced packaging processes. Manufactured using advanced electroforming techniques and high-hardness Ni-Co alloy, these stencils feature exceptional flatness, vertical apertures, and excellent wear resistance, making them ideal for fine-pitch, micro-volume solder paste printing, and high-repeatability automated production lines.

• Key Features

• Highly Stable Flat Structure: Seamless, step-free design with uniform thickness ensures consistent print quality.

• High Aperture Accuracy & Repeatability: Tolerance up to ±3 μm guarantees stable performance in every cycle.

• Heat-Free Electroforming Process: Avoids taper holes and thermal distortion common in laser-cut stencils.

• Durable Ni-Co Alloy Material: High hardness and corrosion resistance for extended use.

• Ultra-Smooth Aperture Walls & Surface Finish: Improves paste release, reduces residue, and boosts transfer efficiency
  
  

• Product Applications

• SMT solder paste printing (Fine-pitch QFP, CSP, BGA, etc.)

• BGA / WLCSP reballing stencils.

• Miniature or high-density mixed component boards.

• Integration with automated solder paste printers.

• High-reliability electronic modules, automotive, and medical electronics.

• Precision solder paste printing for Mini LED applications.

• Our Advantages

• In-house electroforming production line ensures fast prototyping and stable mass delivery.

• Supports custom aperture design, thickness, and layout (Gerber / CAD).

• Reliable mass production quality with strict tolerance control.

• Compatible with step-type and 3D structure extensions for versatile applications.