As of June 2025, ENVAR Precision Co., Ltd. has officially changed its name to EVERGLOW Precision Co., Ltd.
The Electroformed Ni-Co Alloy 3D Stencil combines high-precision electroforming technology with three-dimensional structural design, enabling localized raised or recessed features on the stencil surface. This makes it ideal for non-planar printing, component gap compensation, and multi-height packaging requirements. With high strength, wear resistance, and precision, it provides tailored solutions for advanced packaging and customized SMT processes.
3D Structural Design: Enables localized raised or recessed areas; wide range of thickness variations; compatible with step-stencil integration.
Electroformed Construction: Vertical, burr-free apertures with high dimensional accuracy; suitable for ultra-fine pitch components.
High-Hardness Ni-Co Alloy: Excellent mechanical strength and corrosion resistance for repeated and high-frequency operations.
Precision Thickness Control: Supports multi-region thickness customization (e.g., base 80 μm, localized raised areas up to 200 μm).
Supports Complex Layouts: Fully customizable 3D structures based on actual component geometries.
SMT printing for mixed-height components (e.g., raised areas to compensate for lower parts).
Wafer-level packaging and underfill pre-printing.
Mini-LED or COB packaging with raised-printing requirements.
High-reliability precision paste-filling and advanced encapsulation processes.
Customized stencils for non-standard component gap compensation.
Proprietary in-house 3D electroforming technology with full customization support.
Stable and high-precision mass production capabilities.
Expert design team offering fast data conversion and layout consultation.
Fully compatible with automated solder paste printers, reflow processes, and advanced assembly environments.