3D Structure Stencil

• Product Overview

The Electroformed Ni-Co Alloy 3D Stencil combines high-precision electroforming technology with three-dimensional structural design, enabling localized raised or recessed features on the stencil surface. This makes it ideal for non-planar printing, component gap compensation, and multi-height packaging requirements. With high strength, wear resistance, and precision, it provides tailored solutions for advanced packaging and customized SMT processes.

• Key Features

• 3D Structural Design: Enables localized raised or recessed areas; wide range of thickness variations; compatible with step-stencil integration.

• Electroformed Construction: Vertical, burr-free apertures with high dimensional accuracy; suitable for ultra-fine pitch components.

• High-Hardness Ni-Co Alloy: Excellent mechanical strength and corrosion resistance for repeated and high-frequency operations.

• Precision Thickness Control: Supports multi-region thickness customization (e.g., base 80 μm, localized raised areas up to 200 μm).

• Supports Complex Layouts: Fully customizable 3D structures based on actual component geometries.

• Product Applications

• SMT printing for mixed-height components (e.g., raised areas to compensate for lower parts).

• Wafer-level packaging and underfill pre-printing.

• Mini-LED or COB packaging with raised-printing requirements.

• High-reliability precision paste-filling and advanced encapsulation processes.

• Customized stencils for non-standard component gap compensation.

• Our Advantages

• Proprietary in-house 3D electroforming technology with full customization support.

• Stable and high-precision mass production capabilities.

• Expert design team offering fast data conversion and layout consultation.

• Fully compatible with automated solder paste printers, reflow processes, and advanced assembly environments.