Electro-formed Ni-Co Alloy Stencil

• Product Overview

Electroformed Ni-Co alloy stencils are manufactured using a high-precision electroforming process, enabling the creation of micro-scale stencil structures with vertical, burr-free apertures, smooth edges, and uniform thickness. Combined with high-hardness Ni-Co alloy, these stencils deliver outstanding mechanical stability and durability, making them an advanced solution for SMT solder paste printing, BGA ball placement, and WLCSP packaging.

• Key Features

• Straight, Burr-Free Apertures: Electroformed vertical walls enable high solder paste transfer efficiency.

• High Dimensional Accuracy & Stability: Aperture tolerance within ±3 μm; excellent thickness uniformity.

• Smooth Surface for Efficient Paste Release: Reduces residue and improves production yield.

• High Hardness & Wear Resistance: Ni-Co alloy offers superior mechanical strength and corrosion resistance.

• Supports High-Density, Fine-Pitch Printing: Ideal for ultra-fine components.

• Multiple Stencil Formats Supported: Compatible with flat, step, and 3D custom structures.

• Product Applications

• Precision solder paste printing for SMT.

• Ball placement for BGA / CSP / WLCSP packaging.

• Mixed boards with miniature and odd-shaped components.

• Automotive electronics, medical devices, and communication modules.

• Designed for high-yield, automated production systems.

• Our Advantages

• In-house electroforming line for fast prototyping and stable mass production.

• Expert engineering support for custom designs and CAD file conversion.

• Rigorous quality inspection and full-process control to ensure reliability.

• Flexible support for various thicknesses and structures to meet complex packaging demands.