Electro-formed Ni-Co Alloy Stencil

• Product Overview

EverGlow provides high-precision electroformed nickel-cobalt stencil solutions manufactured through advanced electroforming technology. The process enables vertically formed apertures, smooth sidewalls, and highly stable microstructures. Combined with high-hardness Ni-Co alloy materials, Heterogeneous Interface Engineering, and proprietary 2.5D Flow-Control Microstructure technology, our products are designed for demanding SMT printing, BGA ball placement, CSP, WLCSP, and advanced packaging applications.

• Key Features

• High-Precision Electroforming
  Produces vertical aperture walls and smooth edges while minimizing burrs and thermal distortion.

• Excellent Dimensional Accuracy
  Aperture tolerance can be controlled within ±3 μm, ensuring outstanding consistency and repeatability.

• Superior Surface Quality
  Smooth aperture walls help improve material transfer efficiency and reduce residue retention.

• Nickel-Cobalt Alloy Construction
  Provides excellent hardness, wear resistance, and corrosion resistance for extended service life.

• Suitable for Fine-Pitch Applications
  Designed for ultra-fine pitch, high-density, and high-precision packaging processes.

• Proprietary Technology Platform
  Combines Heterogeneous Interface Engineering and 2.5D Flow-Control Microstructure technology to support customized planar, stepped, and three-dimensional electroformed structures.

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• Product Applications

• Precision solder paste printing for SMT.

• Ball placement for BGA / CSP / WLCSP packaging.

• Mixed boards with miniature and odd-shaped components.

• Automotive electronics, medical devices, and communication modules.

• Designed for high-yield, automated production systems.

• Our Advantages

• In-house electroforming line for fast prototyping and stable mass production.

• Expert engineering support for custom designs and CAD file conversion.

• Rigorous quality inspection and full-process control to ensure reliability.

• Flexible support for various thicknesses and structures to meet complex packaging demands.